International

Solder module for edge AI systems

OSM 1.2 module from Tria with NXP i.MX 95

The OSM-LF-IMX95 module from Tria Technologies is equipped with an i.MX 95 application processor from NXP. Developed for edge AI systems, the solder module complies with the SGET's Open Standard Module (OSM) 1.2 specification (size L) and measures 45 mm x 45 mm.

Smallest SoM with NXP i.MX-RT1170 MCU

System-on-Module from Phytec measuring just 30 x 30 mm

According to manufacturer Phytec, the “phyCORE-i.MX RT1170” system-on-module is the...

Cyber-secure Industrial Ethernet

Profinet already ensures CRA compliance

The Industrial Ethernet standard Profinet already provides the basis for CRA...

From previous owner One Stop Systems

Hiper Global acquires Bressner Technology

The international group Hiper Global Ltd. has acquired Bressner Technology GmbH from...

Pilot route in planning

Electric bus / cable car vehicle successful in prototype testing

The Institute for Structural Mechanics and Lightweight Design (SLA), the Chair of High...

Tool chains are the bottleneck

Edge AI needs software, not just powerful hardware

In an interview with Markt & Technik, Rich Simoncic, Microchip Technology's COO,...

STMicroelectronics

Hybrid controller simplifies USB-C sink

The STUSB4531 USB Power Delivery (PD) sink controller from STMicroelectronics...

Rohm

LDO regulator with 500mA and Ultra-small Capacitors

Rohm's BD9xxN5 series LDO regulators deliver up to 500 mA output current and utilise...

Wireless Broadband Alliance

10 Wi-Fi Predictions for 2026 and Beyond

The Wireless Broadband Alliance (WBA), the global industry body dedicated to driving...

Automotive Ethernet Congress 2026

Finding the Right Balance

Where is the sweet spot for Automotive Ethernet applications in the tension between...